R&D Status
- D/F circuit develop technology
- MLB Technology
- Laser / CNC drill optimal machinability
- PSR / Surface treatment
- Via hole plating technology
marking
TOPHigh digital technology power of
DAP will lead the world
2014 | 2015 ~ 2016 | 2017 | 2018 | |
---|---|---|---|---|
Structure | D, 3D Type (10L) |
Any-layer (10L) |
Any-layer (10,12L) |
Any-layer (12L) |
Line / Space | 50/50(µm) |
40/40(µm) |
30/40(µm) |
30/30(µm) |