marking

TOP

Construction

Construction

High digital technology power of
DAP will lead the world

CNC/Laser Drill & Router

  • CNC Drill
  • Drill hole machining process for conduction between layer and layer
Equipment Process
  • Laser Drill
  • Laser processing to form via holes in the insulator
Equipment Process
  • Router
  • Product external form Processing
Equipment Process

MLB

  • Oxide
  • Copper surface oxidation film formation
Equipment Process
  • Lay-up
  • Stack materials according to product structure
Equipment Process
  • Hot Press
  • Harden raw materials through heating and pressing
Equipment Process

Plating

  • Desmear
  • Removing the suspended matter in the via hole
Equipment Process
  • Chemical Plating
  • Form a thin plated layer through chemical reaction
Equipment Process
  • Electrolytic plating
  • Copper plating through electricity
Equipment Process

D/F

  • Exposure
  • Use dry film laminating products with laser light source and harden desired parts
Equipment Process
  • Etching
  • Implementation of product circuit through develop, Etching and stripp process
Process
  • AOI
  • Pre-check of product quality through image matching
Equipment Process

PSR & Surface Treatment

  • PSR (Photo Solder Resist)
  • Protect plated circuit on pcb surface by applying ink to substrate surface
Equipment Process
  • ENIG (Electroness Nikel Immersion Gold)
  • Copper coating with no ink applied for oxidation prevention and SMT ease (Ni/Au Plating)
Equipment Process
  • OSP (Organic Solderability Preservatives)
  • Copper coating with no ink applied for oxidation prevention and SMT ease (Pre-Flux Coating)
Equipment Process