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HDI PCB Structure

A. LVH (Laser Via Hole)

B. Stacked Via

C. BVH (Buried Via Hole)

D. PTH (Plated Through Hole)

E. CCL (Copper Clad Laminate)

F. P/P (Prepreg)

G. C/F (Copper Foil)

H. S/R Ink (Solder Resist Ink)

 

Any Layer

Structure Cross Section
  • Specification
Type Material Board Thickness Min Line Space
All Stack Via FR-4 0.65~1.0T (±10%) 0.03/0.04

 

4D Type

Structure Cross Section
  • Specification
Layer Count Material Board Thickness Min Line Space
10 Layer FR-4 0.65~1.0T(±10%) 0.04/0.04

 

3D Type

Structure Cross Section
  • Specification
Layer Count Material Board Thickness Min Line Space
10 Layer FR-4 0.6~1.0T(±10%) 0.04/0.04, 0.04/0.085

 

D Type

Structure Cross Section
  • Specification
Layer Count Material Board Thickness Min Line Space
10 Layer FR-4 0.8T 0.04/0.04, 0.05/0.05

 

C Type

Structure Cross Section
  • Specification
Layer Count Material Board Thickness Min Line Space
10 Layer FR-4 0.65~0.8T 0.04/0.04, 0.05/0.05

 

B Type

Structure Cross Section
  • Specification
Layer Count Material Board Thickness Min Line Space
10 Layer FR-4 0.65~0.8T 0.04/0.08, 0.05/0.05